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John Yamartino, Vivien Chang, James Holland & Andrey Poliektov, Applied Materials, Inc., Santa Clara, CA, USA Read more >>

H. S. Rathore, D. B. Nguyen, B. Agarwala, K. Chanda, R. G. Filippi, D. Edelstein, C. C. Yang, A. Cowley,W. Landers, M. Yoon, L. Clevenger, J. Demarest, C. R. Davis & C. A. Barile, IBM Systems and Technology Group, Hopewell Junction, NY, USA, C. K. Hu, IBM T. J.Watson Research Center, Yorktown Heights, NY, USA, F. Chen, IBM Systems and Technology Group, Essex Junction, VT, USA, D. Hawken, IBM Systems and Technology Group, Endicott, NY, USA Read more >>

François Thomas, Field Marketing Director, Cadence Europe IC, Velizy, France Read more >>

Ken Sautter, KMS Enterprises, Stuart Allen & Bill Moffat, Yield Engineering Systems Inc., San Jose, CA, USA Read more >>

Yoshihiro Hayashi, System Devices Research Laboratories, NEC Read more >>

Dr. Liang Chen, General Manager, CMP Division, PPC Product Business Group, Applied Materials Inc, USA Read more >>

Prashant Majhi, (Assignment from: Philips Semiconductors), Huang-Chun Wen, Gennadi Bersuker, George Brown, Byoung-Hun Lee, (Assignment from: IBM), & H. Huff, SEMATECH, Austin, Texas, USA Read more >>

Halbert Tam, JSR Micro, Inc., Sunnyvale, CA, USA & Nobuo Kawahashi, JSR Corporation, Yokkaichi, Japan Read more >>

John Michael Bernard, Oytun Guldkin & Ahmed Busnaina, NSF Center for Nano and Micro Contamination Control, Northeastern University, Boston, MA, USA Jingoo Park, Hanyang University, Ansan, Korea Read more >>

Mark I. Gardnera, Sundar Gopalan, Jim Gutt, Paul Kirschb, Siddarth Kirshnan, Jeff Petersonc, Hong-Jyh Lid & Howard R. Huff, International SEMATECH, Austin, Texas, USA Assignment from: a Advanced Micro Devices, b IBM, c Intel d Infineon Read more >>