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White Papers > Wafer Processing

High Pressure Forcefill® PVD for Advanced Aluminium Metallization D. C.

01 March 1999 | Edition 09, Wafer Processing
D. C. BUTLER, Trikon Technologies Ltd., Newport, Gwent, UK
M. N. WEBSTER, A. G. DIRKS, Philips Research Laboratories, Eindhoven, The Netherlands Read more >>

Effective Contact Post-CMP Cleaning

01 March 1999 | Edition 09, Wafer Processing
PROF. A. A. BUSNAINA, DR. N. MOUMEN, M. GUARRERA & J. PIBOONTUM, Clarkson University, Potsdam, NY, USA Read more >>

Copper Metallization Technology for ULSI Chip Interconnects

01 March 1999 | Edition 09, Wafer Processing
MEHRDAD M. MOSLEHI, AJIT PARANJPE, LINO VELO AND TOM OMSTEAD, CVC, Inc., Fremont, CA, USA Read more >>

APCVD TEOS: O3 Advanced Trench Isolation Applications

01 March 1999 | Edition 09, Wafer Processing
TODD O. CURTIS, J. THOMAS PYE, JOHN T. POREDA, Watkins-Johnson Semiconductor Equipment Group, Scotts Valley, CA, USA Read more >>

An Ultra Shallow Junction Module for Deep Sub-micron Technologies by Ion Implantation and Rapid…

01 March 1999 | Edition 09, Wafer Processing

An Ultra Shallow Junction Module for Deep Sub-micron Technologies by Ion Implantation and Rapid Thermal Annealing

MAJEED FOAD, GAËL DE COCK, ADRIAN MURRELL, ERIK COLLART AND DEAN JENNINGS,
Applied Materials, Inc., Santa Clara, CA, USA

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Advancements in SiGe Epitaxy for Production Applications

01 March 1999 | Edition 09, Wafer Processing
N.B. RILEY, DR. P.COMITA, LORI WASHINGTON, Applied Materials, Inc., Santa Clara, CA, USA Read more >>