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White Papers > Wafer Processing

All-Optical, Non-Contact Metrology for Characterising CMP of Copper Films

01 March 2000 | Edition 11, Wafer Processing
MATTHEW BANET, MICHAEL JOFFE, MICHAEL GOSTEIN, ALEX MAZNEV, ROBIN SACCO & FRANÇOISE QUEROMES,
Philips Analytical, Natick, MA, USA Read more >>

A Novel Dual-Damascene ETCH Process Utilising a High-Selectivity, Ultralow-k Dielectric

01 March 2000 | Edition 11, Wafer Processing
TOM ROSENMAYER, JOHN BARTZ, SHICHUN QU & PING XU, W. L. Gore & Associates, Inc., Eau Claire, WI, USA Read more >>

A Breakthrough in Low-k Barrier/Etch Stop Films for Copper Damascene Applications

01 March 2000 | Edition 11, Wafer Processing
PING XU & SUDHA S. RATHI, Applied Materials, Santa Clara, CA, USA Read more >>

Front-End Trends, Challenges, and Potential Solutions for the 180 – 100 nm IC Technology Generatio

01 December 1999 | Edition 10, Wafer Processing
PETER M. ZEITZOFF, SEMATECH Inc., Austin, TX, USA Read more >>

Flowfill® Technology Low-Dielectric-Constant Materials

01 December 1999 | Edition 10, Wafer Processing
WEI-JEN HSIA, WILBUR CATABAY, DUNG-CHING PERNG, & PETER J. WRIGHT, LSI Logic, Santa Clara, CA, USA
LIAM CUNNANE, KNUT BEEKMANN, SIMON MCCLATCHIE & ADRIAN KIERMASZ, Trikon Technologies Ltd, Newport, Gwent, UK Read more >>

Developments in Ceramics for Semiconductor Processing

01 December 1999 | Edition 10, Wafer Processing
FRANCES MARKEL, MATTHEW SIMPSON, OH-HUN KWON & MARC ABOUAF
Saint-Gobain Industrial Ceramics, Inc., Northboro, MA, USA Read more >>

A New CVD Process For Damascene Low k Applications

01 December 1999 | Edition 10, Wafer Processing
BEN PANG, WAI-FAN YAU, PETER LEE & MEHUL NAIK, Applied Materials Inc., Santa Clara, CA, USA Read more >>

A Cleaning Technology for Improved CMP Performance, Productivity and Integration

01 December 1999 | Edition 10, Wafer Processing
GREG WILLITS & BRIAN FRASER, VERTEQ, Inc., Santa Ana, CA, USA Read more >>

Semiconductor Manufacturing in the 21st Century

01 March 1999 | Edition 09, Wafer Processing
R. SINGH, V. PARIHAR, K. F. POOLE, Clemson University, Clemson, SC, USA
K. RAJKANAN, KLA - Tencor Corporation, Miltipas, CA, USA Read more >>

New CoSi2 Silicidation Process for Sub-0.25 µm MOS Technologies

01 March 1999 | Edition 09, Wafer Processing
JAN WAUTERS, KAREN MAEX & ANNE LAUWERS, IMEC, Leuven, Belgium Read more >>