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White Papers > Wafer Processing

The IMEC Clean: Implementation in Advanced CMOS Manufacturing

MARC MEURIS, SOPHIA ARNAUTS, INGRID CORNELISSEN, K. KENIS, M. LUX, STEFAN DEGENDT, PAUL MERTENS,
I. TEERLINCK, R. VOS, L. LOEWENSTEIN & M. M. HEYNS, IMEC, Leuven, Belgium
KLAUS WOLKE, STEAG Microtech, Pliezhauzen, Germany Read more >>

Semiconductor FAB Automation Capabilities Management: An Express Route to Volume Production

01 March 2000 | Edition 11, Wafer Processing
TOM HOGEL & LES MARSHALL, TRW Inc., Austin, TX, USA Read more >>

PVD Copper Barrier/Seed Processes: Some Considerations for the 0.15 µm Generation and Beyond

01 March 2000 | Edition 11, Wafer Processing
GREG HERDT, ALLEN MCTEER & SCOTT MEIKLE, Micron Technology, Inc., Boise, ID, USA Read more >>

MOCVD Processed Ceramic Thin Film Layers for Future Memory Applications

01 March 2000 | Edition 11, Wafer Processing
MARCUS SCHUMACHER, JOHANNES LINDNER, PIOTR STRZYZEWSKI, MARTIN DAUELSBERG & HOLGER JUERGENSEN,
AIXTRON AG, Aachen, Germany
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Data Marts for the Semiconductor Industry

01 March 2000 | Edition 11, Wafer Processing
SERN-IM LEE, IN-BO SIM & TODD C. WILLIAMS, COMPAQ Computer Corporation, Camas, WA, USA Read more >>

Comparing Contact and Non-Contact Technology for Post-CMP Cleaning

01 March 2000 | Edition 11, Wafer Processing
KATRINA MIKHAYLICHENKO & MIKE RAVKIN, Lam Research Corp., Fremont, CA, USA
DAVE STEIN & DALE HETHERINGTON, Sandia National Laboratory, Albuquerque, NM, USA Read more >>

Challenges of Electroplated Copper Film and Device Characteristics for Copper Slurry Design

01 March 2000 | Edition 11, Wafer Processing
MARIA L. PETERSON, ROBERT J. SMALL, TUAN TRUONG & JOO-YUN LEE, EKC Technology, Inc., Hayward, CA, USA Read more >>

Challenges in Copper Interconnect Technology: Macro-Uniformity and Micro-Filling Power in Copper…

01 March 2000 | Edition 11, Wafer Processing

Automated Chemical Management for Production Copper Electroplating

YEZDI DORDI & PETER HEY, Applied Materials, Inc., Santa Clara, CA, USA

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Automated Chemical Management for Production Copper Electroplating

01 March 2000 | Edition 11, Wafer Processing
YEZDI DORDI & PETER HEY, Applied Materials, Inc., Santa Clara, CA, USA Read more >>

Atomic Force Profilometry for Chemical Mechanical Polishing Metrology

01 March 2000 | Edition 11, Wafer Processing
M. G. HEATON, L. M. GE* & F. M. SERRY, Digital Instruments, Veeco Metrology Group, Santa Barbara, CA, USA
*Currently at Intel Corp., Santa Clara, CA, USA Read more >>