Online information source for semiconductor professionals

White Papers > Wafer Processing

A Novel Oxazole Based Low k Dielectric Addresses Copper Damascene Needs

01 June 2000 | Edition 12, Wafer Processing
G. SCHMID, R. SEZI, K. LOWACK, & W. RADLIK, Infineon Technologies, Munich, Germany Read more >>

A New SOI Manufacturing Technology Using Atomic Layer Cleaving

01 June 2000 | Edition 12, Wafer Processing | Comments (1)
FRANCOIS J. HENLEY & MICHAEL I. CURRENT, Silicon Genesis Corporation, Campbell, CA, USA Read more >>

Silicon Oxynitride Films as a Segue to the High-K Era

01 June 2000 | Edition 12, Wafer Processing
A. KARAMCHETI, V.H.C. WATT, H.N. AL-SHAREEF, T.Y. LUO, G.A. BROWN, M.D. JACKSON & H.R. HUFF,
International SEMATECH, Inc., Austin, TX, USA11 Read more >>

SiC Applications for Semiconductor Manufacturing

01 June 2000 | Edition 14, Wafer Processing
SATOSHI KAWAMOTO & FUMITOMO KAWAHARA, ADMAP Inc., Tamano, Okayama, Japan
TROY COLLARD, Mitsui Zosen USA Inc., San Mateo, CA,USA Read more >>

Post-CMP Cleaning of Thermal-Oxide Wafers

01 June 2000 | Edition 12, Wafer Processing
AHMED A. BUSNAINA & NAIM MOUMEN, Clarkson University, Potsdam, NY, USA Read more >>

Photoresist and Photoresist Residue Removal with Supercritical CO2 – A Novel Approach to Cleaning

01 June 2000 | Edition 12, Wafer Processing

Photoresist and Photoresist Residue Removal with Supercritical CO2 – A Novel Approach to Cleaning Wafers

MAXIMILIAN A. BIBERGER & PAUL SCHILLING, Supercritical Systems Inc., Fremont, CA, USA
DON FRYE & MICHAEL E. MILLS, The Dow Chemical Company, Midland, MI, USA Read more >>

Lower Equipment Cost of Ownership Through Spare-Parts-Management Programmes

01 June 2000 | Edition 12, Wafer Processing
ROBERT B. HIXSON, Integrated Device Technology, Hillsboro, OR, USA
PETER N. SWEETNAM, Semiconductor Equipment Technology, Inc., Dublin, CA, USA Read more >>

Wafer Backside Spin-Process Contamination Elimination for Advanced Copper Device Applications

01 March 2000 | Edition 11, Wafer Processing
ERNST GAULHOFER & HEINZ OYRER, SEZ A.G, Austria
BING-YUE TSUI, National Chiao Tung University, Hsinchu, Taiwan Read more >>

Thermally Driven Recrystallisation of Electroplated Copper

01 March 2000 | Edition 11, Wafer Processing
LYNDON GRAHAM & TOM RITZDORF, Semitool, Kalispell, MT, USA
DAVE CLARKE, STEAG RTP Systems, San Jose, CA, USA
RANDHIR THAKUR, STEAG Electronic Systems, San Jose, CA, USA Read more >>

The Importance of Cu in New Generation Process Technologies

01 March 2000 | Edition 11, Wafer Processing
LUDO DEFERM, IMEC, Leuven, Belgium Read more >>