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White Papers > Wafer Processing

Achieving Higher Productivity in Oxide CMP

01 June 2001 | Edition 14, Wafer Processing
CHAD C. GARRETSON, JEFF P. RUDD, BRIAN J. BROWN, DAN FLYNN & STEVE CHEN, Applied Materials, Santa Clara, CA, USA Read more >>

A New Advanced System for Defect Identification on Unpatterned Wafers: the WM-3000 FOUP

01 June 2001 | Edition 14, Wafer Processing
PETER-M. HEINZE, Macrotron Systems GmbH, München, Germany Read more >>

Low-k Dielectrics for Future IC Fabrication

01 December 2000 | Edition 11, Wafer Processing
PETER SERMON, KNUT BEEKMANN AND SIMON MCCLATCHIE, Trikon Technologies Ltd., Newport, South Wales Read more >>

Innovations in Silicon Germanium Bicmos Processing

01 June 2000 | Edition 12, Wafer Processing
STEPHEN ST. ONGE & MARK DUPUIS, IBM Microelectronics Division, Essex Jct, VT, USA# Read more >>

High k Dielectrics for Advanced Dram Applications

01 June 2000 | Edition 12, Wafer Processing
VISWESWAREN SIVARAMAKRISHNAN, PRAVIN NARWANKAR, HELEN ARMER, PATRICIA LIU, JUN ZHAO & RAVI RAJAGOPALAN,
Applied Materials, Inc., Santa Clara, CA, USA Read more >>

Full-Wafer Endpoint Detection Improves Process Control in Copper CMP

01 June 2000 | Edition 12, Wafer Processing
BRET W. ADAMS, BOGDAN SWEDEK, RAJEEV BAJAJ, FRITZ REDEKER, MANUSH BIRANG & GREGORY AMICO,
Applied Materials, Inc., Santa Clara, CA, USA Read more >>

Enhanced Targets Can Reduce Metallisation Cost of Ownership – A Case Study

01 June 2000 | Edition 12, Wafer Processing
THOMAS MEIDLINGER, Micronas GmbH, Freiburg, Germany
DANIEL R. MARX, Praxair MRC*, Orangeburg, NY, USA
JEAN-PIERRE BLANCHET, MRC SA, Toulouse, France Read more >>

ECD Seed Layer for Inlaid Copper Metallisation

01 June 2000 | Edition 12, Wafer Processing
L. CHEN & TOM RITZDORF, Semitool Inc., Kalispell, Montana, USA Read more >>

Control of Damascene Copper Processes by Cyclic Voltammetric stripping

01 June 2000 | Edition 12, Wafer Processing
PETER BRATIN, GENE CHALYT, ALEX KOGAN, MICHAEL PAVLOV & JAMES PERPICH,
ECI Technology, Inc,. East Rutherford, NJ, USA Read more >>

Better Productivity and Faster Cycle Times Through Single- Wafer Processing

01 June 2000 | Edition 12, Wafer Processing
HANS KRUWINUS & HEINZ OYRER, SEZ AG, Villach, Austria Read more >>