Online information source for semiconductor professionals

White Papers > Wafer Processing

Advanced process control of copper electroplating thickness profile

01 March 2008 | Edition 37, Wafer Processing
Sai Boyapati, Kevin Chamness, Frank Smith, Patrick Cowan & John Crowley, Spansion, Inc., Austin, Texas, USA Read more >>

Meeting the doping challenges: the case for plasma doping

01 March 2008 | Edition 37, Wafer Processing
Jose I. Del Agua, Tze Poon, Pete Porshnev $ Majeed Foad, Applied Materials, Inc., Santa Clara, California; Malgorzata Jurczak, Jean-Luc Everaert & Wilfrid Vandervorst, IMEC, Leuven, Belgium Read more >>

Contamination control for the 32nm node

01 March 2008 | Edition 37, Wafer Processing
Twan Bearda, Rita Vos, Paul W. Mertens, Gabriela Catana & Cedric Huyghebaert, IMEC, Leuven, Belgium Read more >>

ALD developments, challenges and emerging applications for current and advanced technologies

01 March 2008 | Edition 37, Wafer Processing
Eric Eisenbraun, College of Nanoscale Science and Engineering (CNSE), The University of Albany, New York, USA Read more >>

Shallow probe metrology

01 March 2008 | Edition 37, Wafer Processing
Addressing the challenges in elemental composition, thickness determination, and dopant dosimetry from FE to BE

Mona P. Moret, Chrystel Hombourger, Francois Desse, Rabah Bengbalagh, Valerie Paret & Michel Schuhmacher, CAMECA, France Read more >>

Front End surface preparation comes of age

01 December 2007 | Edition 36, Wafer Processing
Dave Chapek, Semitool, Montana, USA Read more >>

X-ray metrology tool for new device materials and structures

01 December 2007 | Edition 36, Wafer Processing
Dr. Paul Ryan, Bede X-Ray Metrology plc, Durham, England Read more >>

Full copper electrochemical mechanical planarization (Ecmp) as a technology enabler for the 45nm

01 September 2007 | Edition 35, Wafer Processing
M. Mellier, T. Berger, R. Duru, O. Hinsinger & G. Wyborn, STMicroelectronics, France; M. Rivoire, CEA–LETI, France & K-L. Chang, Y. Wang, V. Ripoche, S. Tsai & M. Thothadri, Applied Materials, USA Read more >>

External resistance: a paradigm shift in approaching strain engineering

01 September 2007 | Edition 35, Wafer Processing
R. Arghavani, A. M. Noori, A. Gelatos, A. Khandelwal, S. Gandikota &
S. Felch, Applied Materials, California, USA, & S. E. Thompson, University of Florida, USA Read more >>

Defect monitoring on memory devices using broadband brightfield inspection

01 September 2007 | Edition 35, Wafer Processing
Uwe Seifert & Carlos Mata, Qimonda AG, Dresden, Germany; Thomas Trautzsch & Martin Tuckermann, KLA-Tencor GmbH, Dresden, Germany; Aneesh Khullar, Jorge Fernandez & Catherine Perry-Sullivan, KLA-Tencor Corporation, California, USA
Read more >>