L.H.A. Leunissen, IMEC, Leuven, Belgium, G. F. Lorusso, T. DiBiase, H. Yang & A. Azordegan, KLA-Tencor Corporation, San Jose, CA, USA
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Kelly Barry & Sanjay Yedur, Timbre Technologies, Inc., Santa Clara, CA, USA#
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Florence Eschbach, Intel Corporation, Intel Mask Operations, Santa Clara, CA, USA, and Alex Gallegos, Intel Corporation, Fab21, Rio Rancho, NM, USA
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S.V. Sreenivasan, Ian McMackin, Frank Xu, David Wang & Nick Stacey, Molecular Imprints, Inc., Austin, Texas, USA and Doug Resnick, Motorola Research Laboratories, Tempe, AZ, USA
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Vivek M. Prabhu & Eric K. Lin, National Institute of Standards and Technology, Gaithersburg, USA
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Mark E. Mason, Texas Instruments Incorporated, Dallas, Texas, USA
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Mark Osborne, Editor-in-Chief, Semiconductor Fabtech
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M. Dilger, F. Gans & J.H. Peters, Advanced Mask Technology Center GmbH & Co. KG, Dresden, Germany
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Ron A. Synowicki, Greg K. Pribil, Gerry Cooney, Craig M. Herzinger & Steven E. Green, J.A. Woollam Co., Inc. 645 M Street, Suite 102, Lincoln, NE, USA, Roger H. French, Min K. Yang, M.F. Lemon, DuPont Co Central Research, E356-384, Wilmington, DE, USA, John H. Burnett & Simon Kaplan, National Institute of Standards and Technology, Atomic Physics Division, 100 Bureau Drive, Gaithersburg, MD, USA
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Ming Yeon Hung, Taiwan Semiconductor Manufacturing Company Xuemei Chen,
KLA-Tencor Corporation George Shanthikumar, University of California at
Berkeley, CA, USA
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