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White Papers > Lithography

Fabless/Foundry DFM: 45nm and beyond

01 December 2006 | Edition 32, Lithography
Peter Rabkin, Michael Hart & Daniel Gitlin, Xilinx, Inc., San Jose, California Read more >>

Progress in understanding and reducing immersion related defectivity and resist leaching

01 September 2006 | Edition 31, Lithography
Monique Ercken, Mireille Maenhoudt & Mieke Van Bavel*, IMEC, Leuven, Belgium *Scientific editor Read more >>

Printability study with polarization capable aims™ fab 193i to study polarization effects

01 June 2006 | Edition 30, Lithography
Axel Zibold, Ulrich Stroeßner, Andrew Ridley, Carl Zeiss SMS GmbH, Germany
Vicky Philipsen, Joost Bekaert, Live van Look, IMEC, Belgium
Read more >>

Lithography value drivers in IC design & manufacturing

01 June 2006 | Edition 30, Lithography
Peter Jenkins, Hans Kattouw, Skip Miller & Frank van Bilsen, ASML, Netherlands, & Axel Nackaerts & Staf Verhaegen, IMEC, Belgium Read more >>

Litho metrology challenges for the 45nm technology node and beyond

01 March 2006 | Edition 29, Lithography
John A. Allgair, Freescale assignee to International SEMATECH Manufacturing Initiative (ISMI), Austin, TX, USA, Benjamin D. Bunday, Mike Bishop & Pete Lipscomb, International SEMATECH Manufacturing Initiative (ISMI), Austin, TX, USA Read more >>

Design and process limited yield at the 65-nm node and beyond

01 December 2005 | Edition 28, Lithography
Kevin Monahan and Brian Trafas, KLA-Tencor Corporation, Milpitas, California 95035, USA Read more >>

Real-time monitors: Review and lithography applications

01 August 2005 | Edition 27, Lithography
Robin Danfelt, Senior Contamination Control Engineer, Nikon Precision, Belmont, CA, USA Read more >>

AFM in silicon technology development

01 August 2005 | Edition 27, Lithography
Vladimir A. Ukraintsev, Silicon Technology Development, Texas Instruments Inc., Dallas, TX, 75265, USA Read more >>

In-line purge gas monitoring for 193nm lithography: Detecting acid contaminants at low ppt-levels

01 June 2005 | Edition 26, Lithography
Roel Gronheid, IMEC, Lithography Department, Kapeldreef, Leuven, Belgium, & Rida Al-Horr, Dionex Corporation, Sunnyvale, CA, USA Read more >>

Grand challenges of advanced resist technology

01 June 2005 | Edition 26, Lithography
Jan Makos-Brotherton, Texas Instruments Assignee to SEMATECH, Will Conley, Freescale Semiconductor Assignee to SEMATECH, Kim Dean, SEMATECH, Jeff Meute IBM Assignee to SEMATECH, & Karen Turnquest, AMD Assignee to SEMATECH, Austin, TX, USA Read more >>