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White Papers > Fab Management

Refurbished equipment coming on the market

01 March 2008 | Edition 37, Fab Management
Dean W. Freeman, Gartner Dataquest, San Jose, California Read more >>

Enabling operational excellence through an integrated manufacturing IT baseline

01 July 2007 | Edition 35, Fab Management
By Reiner Missale, Qimonda AG, Germany Read more >>

Time synchronization solutions

01 April 2007 | Edition 33, Fab Management
By Gino Crispieri, e-Manufacturing Project PMP, ISMI, Texas, USA Read more >>

Short-Interval Detailed Production scheduling in 300mm semiconductor manufacturing using Mixed In-te

01 December 2006 | Edition 32, Fab Management
Robert Bixby, ILOG Inc., & Rich Burda & David Miller, IBM, U.S.A.
 
Read more >>

Discussion topic: Interface A and the and the road to adoption

01 September 2006 | Edition 31, Fab Management
Discussion panel contributors include: Harvey Wohlwend, Manager International SEMATECH Manufacturing
Initiative, Mark Pendleton, Principal Software Architect, Asyst Technologies & Michael Arnold, Managing
Director and Program Manager fab services, PEER Group. Read more >>

The status and future of copper CMP technology and consumables need

01 June 2006 | Edition 30, Fab Management
Michael Corbett and Mark Thirsk, Linx Consulting LLC Read more >>

Discussion topic: Double Patterning technical concerns and its impact on fab operations

01 March 2006 | Edition 29, Fab Management
Walt Trybula, The Trybula Foundation Inc., & Brian Grenon, Grenon Consulting, Christian K. Kalus, President and Chief Technology Officer, SIGMA-C, Munich, Germany, Nigel Farrar, Vice President Lithography Applications, Cymer Inc., San Diego, CA, USA, Frank D. Masciocchi, Senior Vice President of Sales and
Marketing, Litel Instruments, San Diego, CA, USA, Martin McCullum, Programme Manager, Advanced Lithography Development, Nikon Precision Europe, Mircea Dusa, Senior Scientist & ASML Fellow, ASML, The Netherlands, & Rainer Pforr, Principal Engineer, Future Lithography, Infineon Technologies, Dresden, Germany Read more >>

increasing factory efficiency: an in-depth look at tool- and wafer-level control

01 December 2005 | Edition 28, Fab Management
Matthew Purdy, Advanced Micro Devices Read more >>

Impact of single-wafer clean on manufacturing efficiency – semiconductor fab perspective

01 August 2005 | Edition 27, Fab Management
Ashwin Ghatalia, Kranthi Adusimilli, Dave Dyer, Walter Worth, Robert Wright, Phil Naughton, Joel Barnett, Steve Burnett Read more >>

300mm fab automation: Towards 7th heaven

01 June 2005 | Edition 26, Fab Management
Mark Osborne, Editor-in-Chief, Semiconductor Fabtech Read more >>