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An Analysis of Fluorinated Compound Emissions Reduction Technologies and Emission Reduction Goals

01 March 2000 | Edition 11, EHS

Reproduced by permission of The Electrochemical Society, Inc.

LAURIE BEU & PAUL THOMAS BROWN, Motorola, Austin, TX, USA

ABSTRACT
Fluorinated compounds (FCs) are essential to the semiconductor manufacturing process for plasma chamber cleaning and plasma etching. Because FCs have extremely long atmospheric lifetimes and are strong infrared absorbers, efforts have been undertaken to identify methods to reduce atmospheric emissions. The U.S., Japanese, Korean and European semiconductor industries have established separate voluntary programs calling for the reduction of FC emissions; furthermore, at the World Semiconductor Council (WSC), efforts have begun to address FC emissions on an international basis with FC emissions reduction goals recently established. The Kyoto Protocol includes perfluorocarbons (PFC), hydrofluorocarbons (HFCs) and sulfur hexafluoride (SF6) in the basket of gases subject to voluntary emissions reduction goals in the 2008-2012 timeframe. Efforts to develop FC emissions reduction goals are complicated because emissions reduction technology is in the research and development stage with limited commercial availability and unknown applicability at wafer sizes greater than 200mm. Establishing goals is further complicated because the industry must predict growth over the next 10-15 years, and must determine the impact manufacturing and process changes will have on FC emissions over this time frame. This paper will provide an overview of FC emissions reduction technologies including effectiveness and cost to implement. The factors affecting establishment of long term FC emissions reduction goals will be discussed and several goal strategies and their impact on long-term emissions will be analysed.

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Environmental Requirements Applicable to Copper-Based Semiconductor Deposition Processes in the…

01 December 1999 | Edition 10, EHS
Environmental Requirements Applicable to Copper-Based Semiconductor Deposition Processes in the United Kingdom, Ireland, Singapore and Taiwan Read more >>

Effective PFC Gas Abatement in a Production Environment

01 December 1999 | Edition 10, EHS
ANDREW SEELEY, PHIL CHANDLER, STEVE COTTLE & PETER MAWLE,
BOC Edwards Exhaust Management Systems, Nailsea, UK Read more >>

Characterization of Process Emissions Using FTIR Technology ‚?? A Case Study: Emissions and…

01 December 1999 | Edition 10, EHS
Characterization of Process Emissions Using FTIR Technology – A Case Study: Emissions and Emission By-Products from Epitaxial Reactors

JON SIGLER, STMicroelectronics Inc., Carrolton, TX, USA
CURTIS LAUSH, Radian International Electronic Systems, Austin, TX, USA Read more >>

Treatment of Pyrophoric Effluents

01 December 1999 | Edition 10, EHS
DAVID BENZING, Benzing Technologies, Inc., San Jose, CA, USA
SAMIR SHIBAN, IESI, Chandler, AZ, USA Read more >>

The Semiconductor Industry‚??s Model Strategy for Global Climate Protection

01 December 1999 | Edition 10, EHS
SALLY D. RAND, United States Environmental Protection Agency, Washington DC, USA Read more >>

VOC Abatement at Texas Instruments Using the Zeolite Concentrator Technology ‚?? A Case Study

01 March 1999 | Edition 09, EHS
ALISON M. MCDOUGALL, Munters, Amesbury, MA, USA
CAMILLE N. LUCKADOO, Texas Instruments, Santa Cruz, CA, USA Read more >>

Remote NF3 Chamber Clean Virtually Eliminates PFC Emissions from CVD Chambers and Improves System…

01 March 1999 | Edition 09, EHS

Remote NF3 Chamber Clean Virtually Eliminates PFC Emissions from CVD Chambers and Improves System..

S. RAOUX, Applied Materials, Santa Clara, CA, USA
J. G. LANGAN, Air Products and Chemicals, Allentown, PA, USA

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Fab Revenue Opportunities from Systematic Risk Management

01 March 1999 | Edition 09, EHS
ROB MOODY PE AND V. DEGIORGIO, Technology Risk Consulting Services, LLC, San Jose, CA, USA
DR. DANNY LAM PHD/MBA AND DR. J. KANZ, PHD/MBA, Fisher-Holstein, Inc., Scottsdale, AZ, USA Read more >>