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White Papers > Edition 37

Shallow probe metrology

01 March 2008 | Edition 37, Wafer Processing
Addressing the challenges in elemental composition, thickness determination, and dopant dosimetry from FE to BE

Mona P. Moret, Chrystel Hombourger, Francois Desse, Rabah Bengbalagh, Valerie Paret & Michel Schuhmacher, CAMECA, France Read more >>