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White Papers > Edition 37

Sources of overlay error in double patterning integration schemes

01 March 2008 | Edition 37, Lithography
David Laidler, Philippe Leray, Koen D’Havé & Shaunee Cheng, IMEC, Leuven, Belgium Read more >>

193nm reticle haze: the dirty little secret and its ultimate solution?

Oleg Kishkovich, Anatoly Grayfer & Frank V. Belanger, Entegris, Inc., Franklin, MA, USA Read more >>

Emerging materials in semiconductors

Mark Thirsk & Mike Corbett, Linx Consulting LLC, Massachusetts, USA Read more >>

Special valve configurations and evolutions for new ALD precursors

John Baxter, Swagelok Company, Solon, OH, USA

The effect of HCl permeaton through PFA on expected component life

Don Grant & Debra Carrieri, CT Associated, Inc., Eden Prairie, Minnesota, USA Read more >>

Advanced process control of copper electroplating thickness profile

Sai Boyapati, Kevin Chamness, Frank Smith, Patrick Cowan & John Crowley, Spansion, Inc., Austin, Texas, USA Read more >>

Meeting the doping challenges: the case for plasma doping

01 March 2008 | Edition 37, Wafer Processing
Jose I. Del Agua, Tze Poon, Pete Porshnev $ Majeed Foad, Applied Materials, Inc., Santa Clara, California; Malgorzata Jurczak, Jean-Luc Everaert & Wilfrid Vandervorst, IMEC, Leuven, Belgium Read more >>

Contamination control for the 32nm node

01 March 2008 | Edition 37, Wafer Processing
Twan Bearda, Rita Vos, Paul W. Mertens, Gabriela Catana & Cedric Huyghebaert, IMEC, Leuven, Belgium Read more >>

ALD developments, challenges and emerging applications for current and advanced technologies

01 March 2008 | Edition 37, Wafer Processing
Eric Eisenbraun, College of Nanoscale Science and Engineering (CNSE), The University of Albany, New York, USA Read more >>

Refurbished equipment coming on the market

01 March 2008 | Edition 37, Fab Management
Dean W. Freeman, Gartner Dataquest, San Jose, California Read more >>