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White Papers > Edition 36

High-k/metal gate materials and processes for 32nm technology

01 December 2007 | Edition 36, Materials and Gases
C. S. Park, G. Bersuker, S. C. Song, P. Kirsch & B. H. Lee, SEMATECH, Austin, Texas; R. Jammy, IBM assignee to SEMATECH
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Prospects of incorporating directed self-assembly into semiconductor manufacturing

01 December 2007 | Edition 36, Lithography
R. Singh, T. Boland, R. Mulye, G. Gaur, J.Steelman, D. Arya, N. Srinidhi and P.Deshmukh, Holcombe Department of Electrical and Computer Engineering and Center for Silicon Nanoelectronics, Clemson University, South Carolina, USA Read more >>

Developing micro ADI methodology for new litho process monitoring strategies

01 December 2007 | Edition 36, Lithography
KLA-Tencor and Qimonda Read more >>

Front End surface preparation comes of age

01 December 2007 | Edition 36, Wafer Processing
Dave Chapek, Semitool, Montana, USA Read more >>

X-ray metrology tool for new device materials and structures

01 December 2007 | Edition 36, Wafer Processing
Dr. Paul Ryan, Bede X-Ray Metrology plc, Durham, England Read more >>