M. Mellier, T. Berger, R. Duru, O. Hinsinger & G. Wyborn,
STMicroelectronics, France; M. Rivoire, CEA–LETI, France & K-L.
Chang, Y. Wang, V. Ripoche, S. Tsai & M. Thothadri, Applied
Materials, USA
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R. Arghavani, A. M. Noori, A. Gelatos, A. Khandelwal, S. Gandikota &
S. Felch, Applied Materials, California, USA, & S. E. Thompson, University of Florida, USA
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Uwe Seifert & Carlos Mata, Qimonda AG, Dresden, Germany; Thomas Trautzsch & Martin Tuckermann, KLA-Tencor GmbH, Dresden, Germany; Aneesh Khullar, Jorge Fernandez & Catherine Perry-Sullivan, KLA-Tencor Corporation, California, USA
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Walter F. Worth, International SEMATECH Manufacturing Initiative, USAa
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Uzodinma Okoroanyanwu, AMD, USA; Remo Kirsch & Marcel Grundkowski, AMD Fab 36, Germany; Rene Wirtz & Wolfram Grundke, AMD Saxony LLC, Germany
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Paul Kirsch, S.C.Song, & Prashant Majhi, SEMATECH & Raj Jammy, IBM assignee to SEMATECH
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By Zsolt TÅ?kei, Mikhail Baklanov, Ivan Ciofi, Yunlong Li & Adam Urbanowicz, IMEC, Leuven, Belgium
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By Michael Gostein, John Byrnes, Alex Mazurenko & Tony Bonanno, Advanced Metrology Systems; Peter Weidner & Alexander Kasic, Qimonda Dresden, Germany;
Philip Abromitis, Qimonda Richmond, USA
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