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White Papers > Edition 32

Site selection for semiconductor manufacturing facilities - current practice and future trends

01 December 2006 | Edition 32, Cleanroom
Steffen Weiser, IBM, Belgium Read more >>

Discussion topic: latest developments in EUV light sources

01 December 2006 | Edition 32, Critical Components
Discussion panel contributors include: Dr. Vivek Bakshi, SEMATECH, Austin, Texas, USA, Dr. Martin
McCallum, Manager, Advanced Lithography and Technology, Nikon Precision Europe GmbH, & Dr. Vadim
Banine, ASML, Veldhoven, The Netherlands Read more >>

Cost of Ownership Challenges in Front-End Thermal Processes

01 December 2006 | Edition 32, Critical Components
Alan Levine, Wright Williams & Kelly, USA Read more >>

Intel’s EHS facilities equipment procurement process

01 December 2006 | Edition 32, EHS
Mike Yurconic, Intel Technology Development EHS (TD EHS), Locationa Read more >>

Short-Interval Detailed Production scheduling in 300mm semiconductor manufacturing using Mixed In-te

01 December 2006 | Edition 32, Fab Management
Robert Bixby, ILOG Inc., & Rich Burda & David Miller, IBM, U.S.A.
 
Read more >>

Lithography cell productivity improvement approaches

01 December 2006 | Edition 32, Lithography
Stefan Hempel, Steffen Volt, & Wolfram Grundke, AMD, Dresden, Germany Read more >>

Fabless/Foundry DFM: 45nm and beyond

01 December 2006 | Edition 32, Lithography
Peter Rabkin, Michael Hart & Daniel Gitlin, Xilinx, Inc., San Jose, California Read more >>

CMP chemistry and materials challenges for ultra low-k integration

01 December 2006 | Edition 32, Materials and Gases
Robert L. Rhoades, Entrepix, Inc., Arizona, USA & Gautam Banerjee, Air Products and Chemicals, Inc., Arizona, USA
Read more >>

Strain engineering push to the 32nm

01 December 2006 | Edition 32, Wafer Processing
Reza Arghavani, Hichem M’Saad, Ellie Yieh, Gary Miner & Satheesh Kuppurao, Applied Materials,
California, & Scott E. Thompson, University of Florida Read more >>

Deep trench metrology challenges for 75nm DRAM technology

01 December 2006 | Edition 32, Wafer Processing
Peter Weidner, Alexander Kasic, Thomas Hingst & Thomas Lindner, Qimonda Dresden, Germany Read more >>