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White Papers > Edition 28

Magnetic fields and the technology challenges they pose (a semiconductor perspective)

01 December 2005 | Edition 28, Cleanroom
Julian A. Montoya and Vincent Esqueda, Intel Corporation Read more >>

Improved methodologies for the prediction of footfall-induced vibration

01 December 2005 | Edition 28, Critical Components
Michael Willford, Arup, London, UK,
Caroline Field, Arup, San Francisco, USA Read more >>

Buildings for nanotechnology: a look back at the genesis of a new building type

01 December 2005 | Edition 28, Cleanroom
Hal Amick, Colin Gordon & Associates Read more >>

The critical components of a production-worthy ald system

01 December 2005 | Edition 28, Critical Components
Jon Owyang, Jeff Bailey and Subrata Chatterji, Aviza Technology, Inc. CA 95066, USA Read more >>

Water sustainability

01 December 2005 | Edition 28, EHS
Pablo Ruiz, Texas Instruments Read more >>

increasing factory efficiency: an in-depth look at tool- and wafer-level control

01 December 2005 | Edition 28, Fab Management
Matthew Purdy, Advanced Micro Devices Read more >>

Design and process limited yield at the 65-nm node and beyond

01 December 2005 | Edition 28, Lithography
Kevin Monahan and Brian Trafas, KLA-Tencor Corporation, Milpitas, California 95035, USA Read more >>

in-line metrology and control of gas mixtures in semiconductor processing applications

01 December 2005 | Edition 28, Materials and Gases
Josep Arnó (ATMI Inc.) and Craig Printy (National Semiconductor) Read more >>

Cost-reduction opportunities through tote supply of chemicals and slurry

01 December 2005 | Edition 28, Materials and Gases
J. Connelly and W. Curcie, Infineon Technologies Read more >>

Selective single-wafer wet etching of hf-based layers

01 December 2005 | Edition 28, Wafer Processing
H. Kraus, F. Kovacs, J. Snow, M. Claes, V. Paraschiv, R. Vos, P. W. Mertens, S. De Gendt, M. Heyns, L. Archer
SEZ AG, Draubodenweg 29, Villach Austria IMEC, Kapeldreef 75, Leuven, Belgium Read more >>