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White Papers > Edition 25

Considerations regarding the appropriate timing for advanced technology facility vibration surveys

01 March 2005 | Edition 25, Cleanroom
Hal Amick, Ph.D., P.E., Michael Gendreau, INCE.Bd.Cert, Colin Gordon & Associates, San Bruno, CA, USA Read more >>

Copper CMP treatment using the Copper Selectâ?˘ process

01 March 2005 | Edition 25, EHS
Michael W. Wismer & Richard E.Woodling, USFilter, Milpitas, CA, USA Read more >>

IC market trends in 2005: Picking the positives

01 March 2005 | Edition 25, Fab Management
Mark Osborne, Editor-in-Chief, Semiconductor Fabtech Read more >>

On-line spectral analysis of line edge roughness: algorithms qualification and transfer to etch

01 March 2005 | Edition 25, Lithography
L.H.A. Leunissen, IMEC, Leuven, Belgium, G. F. Lorusso, T. DiBiase, H. Yang & A. Azordegan, KLA-Tencor Corporation, San Jose, CA, USA Read more >>

ODP for post-lithography metrology of 3D structures

01 March 2005 | Edition 25, Lithography
Kelly Barry & Sanjay Yedur, Timbre Technologies, Inc., Santa Clara, CA, USA# Read more >>

Impact of photoinduced defects to ARF lithography

01 March 2005 | Edition 25, Lithography
Florence Eschbach, Intel Corporation, Intel Mask Operations, Santa Clara, CA, USA, and Alex Gallegos, Intel Corporation, Fab21, Rio Rancho, NM, USA Read more >>

Enhanced nanoimprint process for advanced lithography applications

01 March 2005 | Edition 25, Lithography
S.V. Sreenivasan, Ian McMackin, Frank Xu, David Wang & Nick Stacey, Molecular Imprints, Inc., Austin, Texas, USA and Doug Resnick, Motorola Research Laboratories, Tempe, AZ, USA Read more >>

Metal-gate integration challenges

Kirklen Henson & Malgorzata Jurczak, IMEC, Leuven, Belgium Read more >>

Enhancing process control flexibility for sub-90nm applications

01 March 2005 | Edition 25, Wafer Processing
John Yamartino, Vivien Chang, James Holland & Andrey Poliektov, Applied Materials, Inc., Santa Clara, CA, USA Read more >>

Copper interconnects with CVD low-k BEOL dielectric and their reliability

01 March 2005 | Edition 25, Wafer Processing
H. S. Rathore, D. B. Nguyen, B. Agarwala, K. Chanda, R. G. Filippi, D. Edelstein, C. C. Yang, A. Cowley,W. Landers, M. Yoon, L. Clevenger, J. Demarest, C. R. Davis & C. A. Barile, IBM Systems and Technology Group, Hopewell Junction, NY, USA, C. K. Hu, IBM T. J.Watson Research Center, Yorktown Heights, NY, USA, F. Chen, IBM Systems and Technology Group, Essex Junction, VT, USA, D. Hawken, IBM Systems and Technology Group, Endicott, NY, USA Read more >>