Online information source for semiconductor professionals

A life-cycle cost (LCC) fab model – interaction between activities in IC manufacturing and their supporting facilities within a fab

N. Van Hoornick, K. Van den Broeck, J. Van Hoeymissen & M. Heyns, IMEC, Heverlee, Belgium, W. Riedel & C. Braun, M+W Zander, Stuttgart, Germany

Read more >>

Gerhard Schiroky & Gary Henrich, Swagelok Company, Solon, Ohio, USA Read more >>

Walter F.Worth, International SEMATECH, Austin, Texas, USA Read more >>

Thomas J. Sonderman, Advanced Micro Devices, Austin, TX, USA Read more >>

Mark E. Mason, Texas Instruments Incorporated, Dallas, Texas, USA Read more >>

John Michael Bernard, Oytun Guldkin & Ahmed Busnaina, NSF Center for Nano and Micro Contamination Control, Northeastern University, Boston, MA, USA Jingoo Park, Hanyang University, Ansan, Korea Read more >>

Mark I. Gardnera, Sundar Gopalan, Jim Gutt, Paul Kirschb, Siddarth Kirshnan, Jeff Petersonc, Hong-Jyh Lid & Howard R. Huff, International SEMATECH, Austin, Texas, USA Assignment from: a Advanced Micro Devices, b IBM, c Intel d Infineon Read more >>

P.A. Kraus, T.C. Chua, K. Z. Ahmed, J. Campbell, F. Nouri & J. Cruse, Applied Materials, Sunnyvale, CA, USA, A. Rothschild, A. Veloso, S. Mertens & M. Schaekers, IMEC, Leuven, Belgium, F.N. Cubaynes, Philips Research Leuven, Leuven, Belgium, L. Date & R. Schreutelkamp, Applied Materials Belgium, Leuven, Belgium & T. M. Bauer, Sandia National Laboratories, Albuquerque, NM, USA Read more >>

Andreas Knorr, International SEMATECH/Infineon Technologies, Klaus Pfeifer, International SEMATECH & Bernd Kastenmeier, International SEMATECH/IBM Corporation Read more >>

P.H. Haumessera, M. Cordeaua, S. Maîtrejeana & T. Mouriera, CEA-LETI, Grenoble, France, L.G. Gosset & W.F.A. Besling, Philips Semiconductors Crolles R&D, Crolles, France, G. Passemardc & J. Torresc, STMicroelectronics, Crolles, France Read more >>