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White Papers > Edition 21
Selective epitaxy removes roadblocks in the quest for speed
01 March 2004 | Edition 21, Wafer Processing
Arkadii Samoilov and Yihwan Kim, Applied Materials, USA
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Development of a BEOL post-etch cleaning process for cu/low-k integration using the SEZ single wafer
01 March 2004 | Edition 21, Wafer Processing
Development of a BEOL post-etch cleaning process for cu/low-k integration using the SEZ single wafer processor
L. Broussous, P. Besson, O. Hinsinger, T. Billon, S.A. Henry, M. Frank STM microelectronics, 850;Rue Jean Monnet, F38926, Crolles Cedex, France CEA-Leti, 17 rue des Martyrs, 38054 Grenoble Cedex 09, France SEZ AG, Draubodenweg 29, A9500 Villach, Austria
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