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Takako Kimura, Kayo Momoda & Jun Sonobe, Air Liquide Laboratories,Wadai 28, Tsukuba-Shi, Ibaraki-ken, Japan. Yoshihiro Ueno, Air Liquide Japan, Roppongi 1-chome, Minato Ku, Tokyo 106-6010, Japan. Jean-Marc Girard, Air Liquide Electronics Corporate Division, Paris, France Read more >>

P.A. Kraus, C.S. Olsen, K. Ahmed, T.C. Chua, R. Zhao, F. Nouri, & J. Cushing, Front End Products Group, Applied Materials, Inc., Santa Clara, CA, USA Read more >>

D.L. Harame, J.S. Dunn, A. Joseph, S.A. St. Onge, D. Coolbaugh, V. Ramachandran, J. Johnson, P. Cottrel, R. Singh, C. Dickey, IBM, Essex Junction, Vermont,USA, G. Freeman, D. Ahlgren, D. Greenberg, J.-S. Rieh, B. Jagannathan, S.Subbanna,IBM, Hopewell Junction, NY, USA, M. Meghali, IBM Yorktown Hts., NY, USA, O. Schreiber,MCC, San Diego, CA, USA, & T. Tanji, AMCC, Edina, MN, USA Read more >>

K. H. Küsters, J. Alsmeier, J. Faul, J. Lützen, & T. Zell, Infineon Technologies, Dresden, Germany Read more >>

R. Singh1, A. Venkateshan1, M. Fakhruddin1, K. F. Poole1, N. Balakrishnan2 & L.D. Fredendall2, 1Center for Silicon Nanoelectronics, Clemson University, Clemson, SC, USA, 2Department of Management, Clemson University, Clemson, SC, USA Read more >>

Lionel Girardie, MEMSCAP SA, Crolles, France et al Read more >>

A.R. Sitaram#, D.W. Abraham*, C. Alof#, D. Braun#, S. Brown*, G. Costrini§, F. Findeis#, M. Gaidis§, E. Galligan*,W. Glashauser#, A. Gupta*, H. Hoenigschmid#, J. Hummel§, S. Kanakasabapathy*, I. Kasko#,W. Kim#, U. Klostermann#, G.Y. Lee#, R. Leuschner#, K-S. Low#, Yu Lu*, J. Nützel#, E. O’Sullivan*, C. Park#,W. Raberg#, R. Robertazzi*, C. Sarma#, J. Schmid#, P.L. Trouilloud*, D.Worledge*, G. Wright*,W.J. Gallagher*, & G. Müller#, MRAM Development Alliance, IBM/Infineon Technologies, IBM Semiconductor Research and Development Center, Hopewell Junction, NY 12533, USA (# Infineon Technologies, § IBM Microelectronics Division, *IBM Watson Research Center). Read more >>