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White Papers > Edition 17

Invisible Hook-up benefits for Infineons 300mm volume production facility

01 September 2002 | Edition 17, Cleanroom
Neil Truscott, Infineon Technologies SC300 GmbH & Co Kg, Dresden, Germany Read more >>

300mm fab conversions & the chemispherical challenge – a model case study

01 September 2002 | Edition 17, Cleanroom
Peter Csatáry & Klaus Kümmerle, M+W Zander Facility Engineering GmbH, Stuttgart, Germany Read more >>

Has “security” been added to your title?

01 September 2002 | Edition 17, EHS
D. Keith Henson and Michael A. Fitzpatrick, Lockwood Greene, Spartanburg, SC, USA Read more >>

Cost reductions from water conservation efforts at Motorola

01 September 2002 | Edition 17, EHS
Brian Raley & Chris Nauert, Motorola, Austin, Texas, USA Read more >>

Alternative and replacement chemistries for wafer etch and chamber clean

01 September 2002 | Edition 17, EHS
Jeffrey D.Williams, Dept. of Defense, Ft. George G. Meade, MD, USA Read more >>

Spectroscopic Ellipsometry (SE) for materials characterization at 193 and 157nm

01 September 2002 | Edition 17, Lithography
J. N. Hilfiker, J.A.Woollam Co., Inc. Lincoln, NE, USA. F. G. Celii,W. D. Kim, E. A. Joseph, C. Gross, T. Y. Tsui, R. B.Willecke & J. L. Large, Texas Instruments, Dallas, TX, USA. D. A. Miller, International SEMATECH, Austin, TX, USA Read more >>

Patterning of low k dielectrics: Prevention of 248 and 193 nm resist poisoning

01 September 2002 | Edition 17, Lithography
S. Satyanarayana, K. BrennanA, T. JacobsB, R. Berger International SEMATECH, Austin TX ATexas Instruments Assignee, BPhilips Assignee Read more >>

Risk reduction strategies and alternatives for high pressure gases

01 September 2002 | Edition 17, Materials and Gases
W. Karl Olander & Luping Wang, ATMI Inc., Danbury, CT, USA Read more >>

The integration of high-k dielectrics: A story of modest achievements

01 September 2002 | Edition 17, Wafer Processing
Matty Caymax & Mieke Van Bavel, IMEC, Leuven, Belgium Read more >>

Microeconomics of accelerated shrinks in demand-limited markets

01 September 2002 | Edition 17, Wafer Processing
Kevin Monahan, Adil Engineer, Goerges Falessi, Matt Hankinson, Sung Jin Lee, Ady Levy & Mike Slessor, KLA-Tencor Corporation, San Jose, CA, USA Read more >>