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Plasma Doping as an Alternative Route for Ultra-Shallow Junction Integration to Standard CMOS Technologies
DAMIEN LENOBLE, STMicroelectronics, Crolles Cedex, France
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ANURAG JINDAL, SHARATH HEGDE & S.V. BABU, Clarkson University, Potsdam, NY, USA
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Local Electrochemical Analysis (LEA) Applications for the Analysis of Copper Films used in Damascene Processing
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DICK JAMES & DAN STUDINER, Chipworks, Ottawa, Canada
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STEVE LASSIG, Lam Research Corporation, Fremont, CA, USA
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FRED LAKHANI, International SEMATECH, Austin, Texas, USA KENNETH W. TOBIN & THOMAS P. KARNOWSKI, Oak Ridge National Laboratory, Tennessee, USA
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