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White Papers > Edition 16

Pulsed Electrolytic Deposition of Pt/Au Schottky Contacts on GaAs for Thz Applications

01 March 2002 | Edition 16, Wafer Processing
VICTORIA ICHIZLI, MANUEL RODRÍGUEZ-GIRONÉS & HANS L. HARTNAGEL, Institut für Hochfrequenztechnik, TU Darmstadt, Germany Read more >>

Plasma Doping as an Alternative Route for Ultra-Shallow Junction Integration to Standard CMOS Techno

01 March 2002 | Edition 16, Wafer Processing
Plasma Doping as an Alternative Route for Ultra-Shallow Junction Integration to Standard CMOS Technologies

DAMIEN LENOBLE, STMicroelectronics, Crolles Cedex, France

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Mixed Abrasive Slurry: A Study on Metal CMP

01 March 2002 | Edition 16, Wafer Processing
ANURAG JINDAL, SHARATH HEGDE & S.V. BABU, Clarkson University, Potsdam, NY, USA Read more >>

Local Electrochemical Analysis (LEA) Applications for the Analysis of Copper Films used in Damascene

01 March 2002 | Edition 16, Wafer Processing
Local Electrochemical Analysis (LEA) Applications for the Analysis of Copper Films used in Damascene Processing

MICHAEL PAVLOV, PETER BRATIN & GENE CHALYT, ECI Technology, East Rutherford, NJ, USA

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Interconnect and Dielectric Technologies â?? Whatâ??s Actually Being Made and Sold?

01 March 2002 | Edition 16, Wafer Processing
DICK JAMES & DAN STUDINER, Chipworks, Ottawa, Canada Read more >>

In Situ Single Chamber Processing: A Proven Capability for Dielectric Etch Processes

01 March 2002 | Edition 16, Wafer Processing
STEVE LASSIG, Lam Research Corporation, Fremont, CA, USA Read more >>

Fast, In-line Copper Metrology Using Optoacoustics

01 March 2002 | Edition 16, Wafer Processing
ALEC READER, MICHAEL GOSTEIN, JOSHUA TOWER & CHRIS MOORE, Philips Analytical, Almelo, The Netherlands Read more >>

Fast Loop Data Mining Improves Fab Profitability

01 March 2002 | Edition 16, Wafer Processing
ANDREW SKUMANICH, Applied Materials, Santa Clara, CA, USA
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Atomic Layer Deposition Reaches Marathon Maturity

01 March 2002 | Edition 16, Wafer Processing
ROBERT B. CLARK-PHELPS, ANURANJAN SRIVASTAVA, LANCE CLEVELAND, ANA LONDERGAN, OFER SNEH & THOMAS E. SEIDEL, Genus, Sunnyvale, CA, USA Read more >>

An Assessment of the Current State of Automatic Defect Classification Technologies, Tools and Practi

01 March 2002 | Edition 16, Wafer Processing
FRED LAKHANI, International SEMATECH, Austin, Texas, USA KENNETH W. TOBIN & THOMAS P. KARNOWSKI, Oak Ridge National Laboratory, Tennessee, USA
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