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White Papers > Edition 15

Advanced Mask-Making with a Variable-Shaped Electron Beam

01 December 2002 | Edition 15, Lithography
HANS C. PFEIFFER & JOHN HARTLEY, US IBM, Hopewell Junction, NY, USA Read more >>

Valve Seal Solution Eliminates Coolant Leakage Problem, has Potential to Save Fabs $500,000 or More

01 December 2002 | Edition 15, Materials and Gases
JOHN BAXTER, Swagelok Company, Solon, OH, USA Read more >>

The Preservation of Purity or The Art of Packaging

01 December 2002 | Edition 15, Materials and Gases
WOLFGANG J. SIEVERT, Honeywell Seelze GmbH, Seelze, Germany Read more >>

Selective Removal Strategies for Low k Dual Damascene

01 December 2002 | Edition 15, Wafer Processing
STEVE LASSIG, SIMON MCCLATCHIE & ADRIAN KIERMASZ, Lam Research Corporation, Fremont, CA, USA Read more >>

Process Control and Defect Inspection Strategies for 300mm Fabs

01 December 2002 | Edition 15, Wafer Processing
ANANTHA SETHURAMAN, SAGAR A. KEKARE, RAMAN NURANI & DADI GUDMUNDSSON,
KLA-Tencor Inc., San Jose, CA, USA Read more >>

Optical Digital Profilometry: A Breakthrough Technology for Non-Destructive Inline Profile and CD Me

01 December 2002 | Edition 15, Wafer Processing
KELLY BARRY, MIKE LAUGHERY, NICKHIL JAKATDAR & WENGE YANG, Timbre Technologies Inc., Fremont, California, CA, USA Read more >>

New HDP-CVD Technology for Next-Generation Gap Fill Processes

01 December 2002 | Edition 15, Wafer Processing
BRUNO GEOFFRION, ANJANA PATEL, STEVE KIM, MUHAMED RASHEED, NAREN DUBEY, KEN LAI, JOE D’SOUZA, PADDY KRISHNARAJ &
MANOJ VELLAIKAL, Applied Materials, Santa Clara, CA, USA Read more >>

Measurement of Metal Film Thickness for Copper Interconnects

01 December 2002 | Edition 15, Wafer Processing | Comments (1)
DANIELE CONTESTABLE-GILKES, SAILESH M. MERCHANT & MINSEOK OH, Agere Systems, Orlando, FL, USA Read more >>

Innovative Metal Lift-Off Process Using Dry Carbon Dioxide

01 December 2002 | Edition 15, Wafer Processing
MARTIN EMRICH, MACROTRON Systems GmbH, Munich, Germany
PAUL MILLER, DOUG PRICE & CHARLES BOWERS, Eco-Snow Systems, Inc., Livermore, CA, USA Read more >>

Implant Anneal Using Single Wafer Rapid Thermal Furnace (SRTF) and Lamp-Based RTP System

01 December 2002 | Edition 15, Wafer Processing
WOO SIK YOO & TAKASHI FUKADA, WaferMasters Inc, San Jose, CA, USA
RIU KOMATUBARA, Tokyo Electron Ltd, Tokyo, Japan
JIRO YAMAMOTO, NEC Hiroshima Ltd, Hiroshima, Japan Read more >>