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Surface Preparation Technology Requirements, Challenges, and Proposed Solutions for Future Semiconductor Manufacturing 

JAGDISH PRASAD & M. RAO YALAMANCHILI, SCP Global Technologies, Boise, ID, USA

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National Semiconductor Develops New Complementary Bipolar Process for High Speed, High Performance Analog

MICHAEL MAIDA, National Semiconductor GmbH, Fürstenfeldbruck, Germany

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KENNETH ROSE & CHRISTOPHER MARK, Rensselaer Polytechnic Institute, Troy, NY, USA Read more >>

STEFAN SCHNEIDER, Forschungszentrum Jülich, Jülich, Germany Read more >>

RAJIB AHMED, BRIAN SOPKO & JACOB JORNE, University of Rochester, Rochester, NY, USA Read more >>

MIKHAIL R. BAKLANOV & KONSTANTIN P. MOGILNIKOV, XPEQT, Tessenderlo, Belgium Read more >>

KAREN MAEX, ZS. TOKEI, A. SATTA, F. LANCKMANS, W. WU & F. IACOPI, IMEC, Leuven, Belgium Read more >>

PETER BRATIN, GENE CHALYT & MICHAEL PAVLOV, ECI Technology, East Rutherford, NJ, USA Read more >>

CHAD C. GARRETSON, JEFF P. RUDD, BRIAN J. BROWN, DAN FLYNN & STEVE CHEN, Applied Materials, Santa Clara, CA, USA Read more >>

PETER-M. HEINZE, Macrotron Systems GmbH, München, Germany Read more >>