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White Papers > Edition 12

Optical Simulation of 3D Mask Effects

01 June 2000 | Edition 12, Lithography
ANJA ROSENBUSCH, Sigma-C Inc, Campbell, CA, USA
ANDREAS ERDMANN, Fraunhofer Institute of Integrated Circuits (IIS-B), Erlangen, Germany
CHRISTOPH FRIEDRICH, Infineon Technologies AG, Munich, Germany Read more >>

Important Aspects of DUV Optical Components

01 June 2000 | Edition 12, Lithography
URS NATZSCHKA, MICHAEL SCHULZ-GROSSER & RAINER SCHUHMANN, Linos Photonics GmbH, Goettingen, Germany
UWE LEINHOS, OLIVER APEL & KLAUS MANN, Laser Laboratorium, Goettingen, Germany Read more >>

Cost-Of-Ownership Analysis For 300 mm Lithography Mix-and-Match Applications

01 June 2000 | Edition 12, Lithography
YUAN ZHANG KE & PHIL WARE, Canon USA, Inc, Semiconductor Equipment Division, Irving, TX, USA
KENICHI KOTOKU & YUIICHI YAMADA, Canon Inc, Semiconductor Production Equipment Group, Utsunomiya, Japan Read more >>

Process Requirements for Mass Flow Controllers

GREGORY H. LEGGETT & EDWIN K. ARRANT, Millipore, Allen, TX, USA Read more >>

High-Pressure Point-of-Use Purification of Corrosive Gases: Effect on Gas Distribution Components

R. TORRES, D. FRAENKEL, J. VININSKI, E. HENNIG, T. WATANABE, & V. HOULDING,
Matheson Gas Products, Longmont, CO, USA Read more >>

Automating Environmental, Health and Safety Management in the Semiconductor and Other High…

Automating Environmental, Health and Safety Management in the Semiconductor and Other High Technology Industries

JOANNE SCHROEDER & GLENN MAYER, P.E., EDSG – Environmental Data Solutions Group, CA, USA
RANDOLPH BRUMMETT, Brummett & Associates, Newport Beach, CA, USA

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Silicon Oxynitride Films as a Segue to the High-K Era

A. KARAMCHETI, V.H.C. WATT, H.N. AL-SHAREEF, T.Y. LUO, G.A. BROWN, M.D. JACKSON & H.R. HUFF,
International SEMATECH, Inc., Austin, TX, USA11 Read more >>

Post-CMP Cleaning of Thermal-Oxide Wafers

AHMED A. BUSNAINA & NAIM MOUMEN, Clarkson University, Potsdam, NY, USA Read more >>

Photoresist and Photoresist Residue Removal with Supercritical CO2 – A Novel Approach to Cleaning

Photoresist and Photoresist Residue Removal with Supercritical CO2 – A Novel Approach to Cleaning Wafers

MAXIMILIAN A. BIBERGER & PAUL SCHILLING, Supercritical Systems Inc., Fremont, CA, USA
DON FRYE & MICHAEL E. MILLS, The Dow Chemical Company, Midland, MI, USA Read more >>

Lower Equipment Cost of Ownership Through Spare-Parts-Management Programmes

ROBERT B. HIXSON, Integrated Device Technology, Hillsboro, OR, USA
PETER N. SWEETNAM, Semiconductor Equipment Technology, Inc., Dublin, CA, USA Read more >>