STEPHEN ST. ONGE & MARK DUPUIS, IBM Microelectronics Division, Essex Jct, VT, USA#
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VISWESWAREN SIVARAMAKRISHNAN, PRAVIN NARWANKAR, HELEN ARMER, PATRICIA LIU, JUN ZHAO & RAVI RAJAGOPALAN,
Applied Materials, Inc., Santa Clara, CA, USA
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BRET W. ADAMS, BOGDAN SWEDEK, RAJEEV BAJAJ, FRITZ REDEKER, MANUSH BIRANG & GREGORY AMICO,
Applied Materials, Inc., Santa Clara, CA, USA
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THOMAS MEIDLINGER, Micronas GmbH, Freiburg, Germany
DANIEL R. MARX, Praxair MRC*, Orangeburg, NY, USA
JEAN-PIERRE BLANCHET, MRC SA, Toulouse, France
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L. CHEN & TOM RITZDORF, Semitool Inc., Kalispell, Montana, USA
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PETER BRATIN, GENE CHALYT, ALEX KOGAN, MICHAEL PAVLOV & JAMES PERPICH,
ECI Technology, Inc,. East Rutherford, NJ, USA
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HANS KRUWINUS & HEINZ OYRER, SEZ AG, Villach, Austria
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Application of Advances in Reactor Design to Metal Etch Chambers for Availability, Cost, Process and Throughput Benefits
DAVE GALLEY, WILLIE FUNK & MARY JANE EVANS, ATMEL Corporation, Colorado Springs, CO, USA
KEVIN SANNES, Applied Materials, Colarado Springs, CO, USA
JOHN O’SULLIVAN & DEREK BRODIE, Applied Materials, Sunnyvale, CA, USA
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G. SCHMID, R. SEZI, K. LOWACK, & W. RADLIK, Infineon Technologies, Munich, Germany
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FRANCOIS J. HENLEY & MICHAEL I. CURRENT, Silicon Genesis Corporation, Campbell, CA, USA
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