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White Papers > Edition 12

Innovations in Silicon Germanium Bicmos Processing

01 June 2000 | Edition 12, Wafer Processing
STEPHEN ST. ONGE & MARK DUPUIS, IBM Microelectronics Division, Essex Jct, VT, USA# Read more >>

High k Dielectrics for Advanced Dram Applications

01 June 2000 | Edition 12, Wafer Processing
VISWESWAREN SIVARAMAKRISHNAN, PRAVIN NARWANKAR, HELEN ARMER, PATRICIA LIU, JUN ZHAO & RAVI RAJAGOPALAN,
Applied Materials, Inc., Santa Clara, CA, USA Read more >>

Full-Wafer Endpoint Detection Improves Process Control in Copper CMP

01 June 2000 | Edition 12, Wafer Processing
BRET W. ADAMS, BOGDAN SWEDEK, RAJEEV BAJAJ, FRITZ REDEKER, MANUSH BIRANG & GREGORY AMICO,
Applied Materials, Inc., Santa Clara, CA, USA Read more >>

Enhanced Targets Can Reduce Metallisation Cost of Ownership â?? A Case Study

01 June 2000 | Edition 12, Wafer Processing
THOMAS MEIDLINGER, Micronas GmbH, Freiburg, Germany
DANIEL R. MARX, Praxair MRC*, Orangeburg, NY, USA
JEAN-PIERRE BLANCHET, MRC SA, Toulouse, France Read more >>

ECD Seed Layer for Inlaid Copper Metallisation

01 June 2000 | Edition 12, Wafer Processing
L. CHEN & TOM RITZDORF, Semitool Inc., Kalispell, Montana, USA Read more >>

Control of Damascene Copper Processes by Cyclic Voltammetric stripping

01 June 2000 | Edition 12, Wafer Processing
PETER BRATIN, GENE CHALYT, ALEX KOGAN, MICHAEL PAVLOV & JAMES PERPICH,
ECI Technology, Inc,. East Rutherford, NJ, USA Read more >>

Better Productivity and Faster Cycle Times Through Single- Wafer Processing

01 June 2000 | Edition 12, Wafer Processing
HANS KRUWINUS & HEINZ OYRER, SEZ AG, Villach, Austria Read more >>

Application of Advances in Reactor Design to Metal Etch Chambers for Availability, Cost, Process and

01 June 2000 | Edition 12

Application of Advances in Reactor Design to Metal Etch Chambers for Availability, Cost, Process and Throughput Benefits

DAVE GALLEY, WILLIE FUNK & MARY JANE EVANS, ATMEL Corporation, Colorado Springs, CO, USA
KEVIN SANNES, Applied Materials, Colarado Springs, CO, USA
JOHN O’SULLIVAN & DEREK BRODIE, Applied Materials, Sunnyvale, CA, USA

Read more >>

A Novel Oxazole Based Low k Dielectric Addresses Copper Damascene Needs

01 June 2000 | Edition 12, Wafer Processing
G. SCHMID, R. SEZI, K. LOWACK, & W. RADLIK, Infineon Technologies, Munich, Germany Read more >>

A New SOI Manufacturing Technology Using Atomic Layer Cleaving

01 June 2000 | Edition 12, Wafer Processing | Comments (1)
FRANCOIS J. HENLEY & MICHAEL I. CURRENT, Silicon Genesis Corporation, Campbell, CA, USA Read more >>