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White Papers > Edition 11
A Novel Dual-Damascene ETCH Process Utilising a High-Selectivity, Ultralow-k Dielectric
01 March 2000 | Edition 11, Wafer Processing
TOM ROSENMAYER, JOHN BARTZ, SHICHUN QU & PING XU, W. L. Gore & Associates, Inc., Eau Claire, WI, USA
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A Breakthrough in Low-k Barrier/Etch Stop Films for Copper Damascene Applications
01 March 2000 | Edition 11, Wafer Processing
PING XU & SUDHA S. RATHI, Applied Materials, Santa Clara, CA, USA
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