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White Papers > Edition 11

New Approaches in Mask Inspection and Characterisation

01 March 2000 | Edition 11, Lithography
WOLF STAUD, Applied Materials, Inc., Santa Clara, CA, USA
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Mask Error Factor and Critical Dimension Budgets for Sub-Half Micron CMOS Processes

01 March 2000 | Edition 11, Lithography
GRAHAM ARTHUR, Rutherford Appleton Laboratory, Didcot, Oxon, UK
BRIAN MARTIN, Mitel Semiconductor, Plymouth, Devon, UK Read more >>

Benefiting from New Technology for GEM/SECS to Reduce Time to Market

01 March 2000 | Edition 11, Lithography
JOE BARTOLOMEO & J. D. DETREMPE, Rockwell Automation, Milwaukee, WI, USA Read more >>

An Overview of Cost of Ownership for Optical Lithography at the 100 nm and 70 nm Generations

01 March 2000 | Edition 11, Lithography
ED MUZIO*, PHIL SEIDEL, GIL SHELDEN & JOHN CANNING,
International SEMATECH, Inc., Austin, TX, USA, *Intel Corporation Assignee Read more >>

An Integrated Phase-shifting Software Solution for IC Design to Manufacturing

01 March 2000 | Edition 11, Lithography
HUA-YU LIU, CLIVE WU & XIAOYANG LI, Numerical Technologies Inc., San Jose, CA, USA Read more >>

Advantages to Point-of-Use Filtration of Photoresists in Reducing Contamination on the Wafer Surface

01 March 2000 | Edition 11, Lithography
DENNIS CAPITANIO, Pall Corporation, Port Washington, NY, USA Read more >>

Wafer Backside Spin-Process Contamination Elimination for Advanced Copper Device Applications

01 March 2000 | Edition 11, Wafer Processing
ERNST GAULHOFER & HEINZ OYRER, SEZ A.G, Austria
BING-YUE TSUI, National Chiao Tung University, Hsinchu, Taiwan Read more >>

Thermally Driven Recrystallisation of Electroplated Copper

01 March 2000 | Edition 11, Wafer Processing
LYNDON GRAHAM & TOM RITZDORF, Semitool, Kalispell, MT, USA
DAVE CLARKE, STEAG RTP Systems, San Jose, CA, USA
RANDHIR THAKUR, STEAG Electronic Systems, San Jose, CA, USA Read more >>

The Importance of Cu in New Generation Process Technologies

01 March 2000 | Edition 11, Wafer Processing
LUDO DEFERM, IMEC, Leuven, Belgium Read more >>

The IMEC Clean: Implementation in Advanced CMOS Manufacturing

01 March 2000 | Edition 11, Wafer Processing
MARC MEURIS, SOPHIA ARNAUTS, INGRID CORNELISSEN, K. KENIS, M. LUX, STEFAN DEGENDT, PAUL MERTENS,
I. TEERLINCK, R. VOS, L. LOEWENSTEIN & M. M. HEYNS, IMEC, Leuven, Belgium
KLAUS WOLKE, STEAG Microtech, Pliezhauzen, Germany Read more >>