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White Papers > Edition 11

A Guide to Understanding Surge Suppression Specifications: Part 2

01 March 2000 | Edition 11, Cleanroom
PAUL DELAUP, Lightning Elimination Systems, Covington, LA, USA
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Simultaneous Resolution of Multiple Environmental Issues: the Development of In-Situ RF Plasma…

01 March 2000 | Edition 11, EHS

Simultaneous Resolution of Multiple Environmental Issues: the Development of In-Situ RF Plasma Chamber Clean Processes Using Dilute NF3/He Mixtures

KENNETH A. AITCHISON, Novellus Systems, San Jose, CA, USA

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PFC Reductions by Use of Fast In-Situ FTIR Gas Analysis

01 March 2000 | Edition 11, EHS
MARTIN L. SPARTZ, MATTHEW RICHTER, PETER A. ROSENTHAL & PETER R. SOLOMON,
On-Line Technologies, Inc., East Hartford, CT, USA Read more >>

An Analysis of Fluorinated Compound Emissions Reduction Technologies and Emission Reduction Goals

01 March 2000 | Edition 11, EHS

Reproduced by permission of The Electrochemical Society, Inc.

LAURIE BEU & PAUL THOMAS BROWN, Motorola, Austin, TX, USA

ABSTRACT
Fluorinated compounds (FCs) are essential to the semiconductor manufacturing process for plasma chamber cleaning and plasma etching. Because FCs have extremely long atmospheric lifetimes and are strong infrared absorbers, efforts have been undertaken to identify methods to reduce atmospheric emissions. The U.S., Japanese, Korean and European semiconductor industries have established separate voluntary programs calling for the reduction of FC emissions; furthermore, at the World Semiconductor Council (WSC), efforts have begun to address FC emissions on an international basis with FC emissions reduction goals recently established. The Kyoto Protocol includes perfluorocarbons (PFC), hydrofluorocarbons (HFCs) and sulfur hexafluoride (SF6) in the basket of gases subject to voluntary emissions reduction goals in the 2008-2012 timeframe. Efforts to develop FC emissions reduction goals are complicated because emissions reduction technology is in the research and development stage with limited commercial availability and unknown applicability at wafer sizes greater than 200mm. Establishing goals is further complicated because the industry must predict growth over the next 10-15 years, and must determine the impact manufacturing and process changes will have on FC emissions over this time frame. This paper will provide an overview of FC emissions reduction technologies including effectiveness and cost to implement. The factors affecting establishment of long term FC emissions reduction goals will be discussed and several goal strategies and their impact on long-term emissions will be analysed.

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The Move Towards System-in-a-Package Solutions

01 March 2000 | Edition 11, Fab Management
STEVE LERNER & CLAUDIO TRUZZI, CS2, Zaventem, Belgium Read more >>

Market Trends for the Millenium

01 March 2000 | Edition 11, Fab Management
JOHN SCHULER, SEMI Market Statistics Dept., SEMI, Mountain View, CA, USA
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Enabling Factory Integration with Islands of Software

01 March 2000 | Edition 11, Fab Management
STEVE HAUSLE, GW Associates, Sunnyvale, CA, USA Read more >>

Integrating Manufacturing into your Value Chain

01 March 2000 | Edition 11, Fab Management
STEVEN BUDDE, USDATA Corporation, Richardson, TX, USA
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An Analysis Tool to Determine the Components of Capacity and Cycle Time in a Semiconductor…

01 March 2000 | Edition 11, Fab Management
An Analysis Tool to Determine the Components of Capacity and Cycle Time in a Semiconductor Manufacturing Line Read more >>

Piezoelectric Materials: An Unheralded Component

01 March 2000 | Edition 11, Lithography
STEVEN M. PILGRIM, New York State College of Ceramics at Alfred University, Alfred, NY, USA Read more >>