Environmental Requirements Applicable to Copper-Based Semiconductor Deposition Processes in the United Kingdom, Ireland, Singapore and Taiwan
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ANDREW SEELEY, PHIL CHANDLER, STEVE COTTLE & PETER MAWLE,
BOC Edwards Exhaust Management Systems, Nailsea, UK
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Characterization of Process Emissions Using FTIR Technology – A Case Study: Emissions and Emission By-Products from Epitaxial Reactors
JON SIGLER, STMicroelectronics Inc., Carrolton, TX, USA
CURTIS LAUSH, Radian International Electronic Systems, Austin, TX, USA
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HARALD HEINRICH, Infineon Technologies, Dresden GmbH & Co. OHG, Dresden, Germany
ADRIAN PYKE, Middlesex General Industries Inc., Woburn, MA, USA
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TODD C. WILLIAMS, Compaq Computer Corporation, Camas, WA, USA
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CHARLES H. GIFFORD, Power Engineers, Inc. Hailey, ID, USA
JUSTIN TYLER & MARK F. DUENAS, Power Engineers, Inc. Boise, ID, USA
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SASS SOMEKH, Applied Materials, Inc., Santa Clara, CA, USA
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STEVEN BUDDE, USDATA Corporation, Richardson, TX, USA
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FRANK FRAUENHOFFER & ROLAND STURM, Fraunhofer Institute Manufacturing Engineering and Automation (FhG-IPA),
Stuttgart, Germany
GEORG MÖNCH, MARIO VON PODEWILS, KNUD RICHTER & VOLKER SCHMALFUß,
Thesys Gesellschaft für Mikroelektronik mbH, Erfurt, Germany
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THOMAS ARZT, Clean Room Consulting GmbH, Freiburg, Germany
FREDDY BULCKE, eFBe International Marketing and Engineering Consultancy bvba, Belgium
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