Online information source for semiconductor professionals

White Papers > Cleanroom

300mm FAB Sizing 101

01 December 2002 | Edition 15, Cleanroom
ED GUTTES, FIONA LEE & MONTY STRANSKI, IDC, Portland, OR, USA Read more >>

Invisible Hook-up benefits for Infineons 300mm volume production facility

01 September 2002 | Edition 17, Cleanroom
Neil Truscott, Infineon Technologies SC300 GmbH & Co Kg, Dresden, Germany Read more >>

300mm fab conversions & the chemispherical challenge – a model case study

01 September 2002 | Edition 17, Cleanroom
Peter Csatáry & Klaus Kümmerle, M+W Zander Facility Engineering GmbH, Stuttgart, Germany Read more >>

Cleanroom Protocol Approaches for the Construction Process

01 June 2002 | Edition 14, Cleanroom
ALLAN D. CHASEY, Del E. Webb School of Construction, Tempe, AZ, USA
RAJASHEKAR BISTAIAH, M.A. Mortenson Company, Colorado Springs, CO, USA Read more >>

Risk Assessment Challenges for the 300mm Fab

01 March 2002 | Edition 16, Cleanroom
VINCENT DEGIORGIO, ARUP Risk Consulting, Westborough, MA, USA Read more >>

Retrofitting Cleanrooms to Accommodate 300mm Technology

01 March 2002 | Edition 16, Cleanroom
MICHAEL O’HALLORAN, IDC, Portland, OR, USA Read more >>

Airborne Molecular Contamination Control in Semiconductor Fabs: A Practical Approach

01 March 2002 | Edition 16, Cleanroom
CHRIS MULLER, Purafil, Inc., Doraville, GA, USA Read more >>

Advances in Airborne Molecular Contamination in 300 mm Process Technology

01 March 2002 | Edition 16, Cleanroom
KLAUS KÜMMERLE, M+W Zander Facility Engineering GmbH, Stuttgart, Germany Read more >>

Facility Design & Environmental Protection

01 June 2001 | Edition 14, Cleanroom
JOSEPH HESS, STMicroelectronics’ Rancho Bernardo Facility, San Diego, CA, USA Read more >>

Competitive Strategy for the Semiconductor Industry - A Global Solutions Approach

01 June 2001 | Edition 14, Cleanroom
M. SHAMS TABREZ, Evans Analytical Group, Sunnyvale, CA, USA Read more >>