Hal Amick, Ph.D., P.E., Michael Gendreau, INCE.Bd.Cert, Colin Gordon & Associates, San Bruno, CA, USA
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A life-cycle cost (LCC) fab model – interaction between activities in IC manufacturing and their supporting facilities within a fab
N. Van Hoornick, K. Van den Broeck, J. Van Hoeymissen & M. Heyns, IMEC, Heverlee, Belgium, W. Riedel & C. Braun, M+W Zander, Stuttgart, Germany
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Andy Yang, ProMOS Technologies Inc. Hsinchu, Taiwan, R.O.C.
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Yeong Ruey Shiue, GSMC, Shanghai, People’s Republic of China & Stephen M. Malmros AIA, IDC, Shanghai, Peoples Republic of China
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Michael Bonner (formerly with Advanced Energy Industries, Inc.), & Randall Clark, IBM Microelectronics
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Dr. Martin Weltzer, Siemens Industrial Building Consultants GmbH & Co. OHG, Munich, Germany
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MING-SHAN JENG & FANGHEI TSAU, Industrial Technology Research Institute, Chutung, Taiwan, ROC
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PHIL NAUGHTON, Motorola Facilities Technology Center, Austin, TX, USA
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VICTOR NEUMAN, Alpha Tech, Inc., San Francisco, CA, USA
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