Online information source for semiconductor professionals

X-ray metrology for front-end applications

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

D.E. Joyce & P.A. Ryan, Bede, Durham, UK, & M.Wormington, Bede, Englewood, CO, USA


This article describes the use of modern X-ray diffraction equipment in the field of SiGe assessment. Strain, composition and layer thicknesses can all be measured on production wafers, i.e. nondestructively at high spatial resolution and high accuracy.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Tool Order: Nova’s optical CD metrology system becomes ‘tool of record’ at major foundry - 29 September 2009

Rudolph ships first MetaPULSE system for under-bump metallization processes - 07 February 2012

Tool Orders: Japanese 300mm fab orders Therma-Wave‚??s Opti-Probe systems - 19 October 2005

ODP for post-lithography metrology of 3D structures - 01 March 2005

AFM in silicon technology development - 01 August 2005

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: