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DAVID BENZING, Benzing Technologies, Inc., San Jose, CA, USA
SAMIR SHIBAN, IESI, Chandler, AZ, USA

ABSTRACT
Dynamic oxidation is a highly effective method to abate pyrophoric gases in the effluent of semiconductor processing tools. The technique achieves high conversion efficiencies without active burning or added heat, by forced turbulent mixing of the pyrophorics with air. Through maximizing the contact with oxygen, dynamic oxidation exploits the high reactivity of pyrophorics to ensure their abatement.