RICHARD WOODLING, USFilter, Sunnyvale, CA, USA
ABSTRACT
The semiconductor industry must now treat wastewater generated by processes associated with the use of copper. Concentrated plating solutions and dilute Cu rinse waters can be treated using standard technology, but the high-suspended-solids wastewater from CMP presents a new challenge. A process using pH adjustment, crossflow ceramic microfiltration, activated carbon for oxidant removal and ion exchange for copper removal has been designed. The CMP solids are concentrated by the ceramic microfilter; a diafiltration system has been developed to remove copper from these solids. Laboratory trials of the crossflow filtration process were conducted, using ceramic membranes with pore sizes of 0.2 and 0.02 microns. Tests were performed on a pilot system, including a marathon test where the system operated on process-generated wastewater. Full-scale systems have now been designed and constructed.