Online information source for semiconductor professionals

The State of Array Packaging

01 December 1999 | By Mark Osborne | White Papers > Edition 10

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

STEVE BERRY & SANDRA WINKLER, Electronic Trends Publications, Inc., San Jose, CA, USA


From 1993 through 1996, the “hot” topic in IC packaging was the ball grid array (BGA). Since that time, the hot topic has been the chip scale package (CSP). Reduced to their essence, however, both topics are about the transition to packages with I/O arrays built around substrates rather than leadframes. (Yes, there are leadframe-based CSPs, but the real action will be in substrate-based versions).
Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

The Move Towards System-in-a-Package Solutions - 01 March 2000

IMEC reveals Poly-SiGe micro-mirror array for photomask writers - 15 December 2008

IBM announces $1.5 billion investment in New York operations - 21 July 2008

SRC and selected Universities to form 3D packaging R&D centre - 26 January 2009

Tool order: Mattson receives repeat business for ‚??Alpine‚?? etch system - 23 November 2010

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: