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The State of Array Packaging

01 December 1999 | By Mark Osborne | White Papers > Edition 10

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STEVE BERRY & SANDRA WINKLER, Electronic Trends Publications, Inc., San Jose, CA, USA

ABSTRACT

From 1993 through 1996, the “hot” topic in IC packaging was the ball grid array (BGA). Since that time, the hot topic has been the chip scale package (CSP). Reduced to their essence, however, both topics are about the transition to packages with I/O arrays built around substrates rather than leadframes. (Yes, there are leadframe-based CSPs, but the real action will be in substrate-based versions).
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