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The Move Towards System-in-a-Package Solutions

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STEVE LERNER & CLAUDIO TRUZZI, CS2, Zaventem, Belgium

ABSTRACT

The high integration level and low-latency device characteristics offered by current IC technologies have moved the bottleneck limiting system performance away from the IC level into the packaging field. This article analyses the need for integration between the semiconductor and packaging levels. Area array packaging has become the technology of choice to meet these requirements in areas such as automotive navigation and digital wireless communications. This leads to the system-in-a-package approach. This has the capability to remove large numbers of discrete components using the “embedded passives” technique.
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