Online information source for semiconductor professionals

The IMEC Clean: Implementation in Advanced CMOS Manufacturing

Popular articles

Voltaix names Peter Smith as CEO - 09 November 2011

Sematech Litho Forum: Sematech mulling multi-beam mask writer effort - 12 May 2010

TSMC hosts 2008 Green Forum on ‘green’ factories - 31 October 2008

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

TSMC honors suppliers at annual Supply Chain Management Forum - 03 December 2008

MARC MEURIS, SOPHIA ARNAUTS, INGRID CORNELISSEN, K. KENIS, M. LUX, STEFAN DEGENDT, PAUL MERTENS,
I. TEERLINCK, R. VOS, L. LOEWENSTEIN & M. M. HEYNS, IMEC, Leuven, Belgium
KLAUS WOLKE, STEAG Microtech, Pliezhauzen, Germany

ABSTRACT

This article describes an implementation of the IMEC Clean for pre-diffusion cleans in a CMOS process. To avoid metal contamination HCl is added to the dilute HF. This also ensures particle removal. The particle removal and metal removal efficiencies are compared with those of an RCA clean. The results of monitoring of particle levels over 18 months and Fe concentration over a year are presented. The cost of ownership is also compared with that of an RCA clean.
Download Please login to download the paper. No account yet? Please register. It's free!

Related jobs

No related jobs found, sorry!

Related articles

IMEC expands lab space in Leuven facilities - 07 April 2009

Globalfoundries joins imec’s sub-22nm core CMOS program: EUV lithography included - 04 April 2011

Imec and Coventor team on CMOS integrated MEMS - 01 February 2011

IMEC reduces high-k/metal gate process steps from 15 to 9 - 17 June 2008

IMEC establishes China base for advanced semiconductor process R&D - 25 May 2010

Reader comments

Interesting article
By Larry Shie on 27 April 2010

Post your comment

Name:
Email:
Please enter the word you see in the image below: