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The Advanced 200 mm Fab
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ABSTRACT
Device makers must increase the productivity of process tools because of increasing capital costs. The transition to 300 mm wafers is not expected to start until 2001, so the industry must find a way to add incremental capacity. This will require a combination of technology enhancements (shrinks) and productivity improvements (logistics). Technology enhancements can be achieved by the use of deep ultraviolet and copper interconnects. Productivity enhancements can be obtained with the help of guidelines originally devised for 300 mm fabs. These will lead to new automated material-handling systems and new scheduling software. The benefits of applying these to 200 mm fabs are described.
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