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John Baxter, Swagelok Company, Solon, OH, USA

Atomic layer deposition (ALD) processing technology has advanced significantly in recent years, enabling the use of a wider range of precursor materials, including liquids. The delivery systems for these materials must be compatible with process temperatures up to 250°C. Furthermore, for consistent precursor delivery, the temperature must be controlled within +/-3°C. Meeting the discrete needs of ALD processing is complicated for component manufacturers in part because applications tend to be inconsistent from one to the next and in many cases are experimental. This paper addresses these inconsistencies and offers some insights to the challenges and possible solutions.