Online information source for semiconductor professionals

Slurry metering for CMP

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Steve Holland, Techcet Group, LLC, USA


Chemical Mechanical Polishing (CMP) has become a pervasive process used inmanufacturing virtually every sub-0.25 um generation semiconductor wafer that has a multilevel metal structure. CMP is generally considered to have a high cost of ownership due to the high consumables, and specifically slurry, cost. This article describes technologies that lower cost by delivering precise and reproducible amounts of slurry to the pad. No longerdo chip manufacturers have to use excess slurry flow to insure a minimumslurry flow. There is also antidotal evidence from early adapters ofcontrolled slurry flow devices that using reproducible amounts of slurry can enhance the wafer yields. Furthermore, improved slurry or chemistry metering to the CMP tool will allow optimizing the slurry used by process,or even at different steps of the process. These new flow controltechnologies allow controlled flow without compressive action on the slurry and without any obstruction to the flow, thus greatly reducing the risk of defect generation or particle agglomeration.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Effect of pump type on the health of various CMP slurries - 01 April 2007

Copper CMP treatment using the Copper Select‚?Ę process - 01 March 2005

Rohm and Haas claims 20 percent reduction in tungsten CMP consumable costs - 23 April 2008

CMP consumables supplier shakeout seen by Techcet - 02 June 2010

Advanced CMP consumable design for defectivity control - 01 December 2004

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: