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Risk Assessment Challenges for the 300mm Fab
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VINCENT DEGIORGIO, ARUP Risk Consulting, Westborough, MA, USA
ABSTRACT
The first wave of 300-millimetre (300mm) semiconductor wafer fabrication facilities (Fab) is here, complete with Front Opening Unified Pods (FOUPs) and fully Automated Material Handling Systems (AMHS). The huge, several billion-dollar (USD) capital expenditure to build and equip these facilities, and the projected 30–40% cost savings per die, have significantly increased the physical and operational risk exposure. The total dependence on interbay & intrabay automation presents a serious process interruption risk potential. Other changes in Fab and tool configurations will be highlighted. It is important to note that due to the newness of the 300mm Fab, not all risks have been uncovered and/or fully understood.
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