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RF-based sensor technology improves cleaning efficiency on PECVD tools

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Michael Bonner (formerly with Advanced Energy Industries, Inc.), & Randall Clark, IBM Microelectronics


Implementing an active RF sesorbased endpoint of PECVD chamber cleaning on several process tools in a wafer fab production line has demonstrated how this approach can reduce gas consumption and processing times, as well as increase tool throughput and improve onwafer particle performance

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