MICHAEL O’HALLORAN, IDC, Portland, OR, USA
ABSTRACT
The microelectronics industry has patiently endured a long period of anticipation waiting for 300mm manufacturing technology to become viable. When 300mm technology and the production tools necessary to achieve it finally arrived, manufacturers faced a critical choice: to either build new wafer fabs at a cost of more than $1 billion each, or retrofit existing 200mm operations.