Online information source for semiconductor professionals

Reducing chiller system power consumption at PSC 12A

01 March 2006 | By Mark Osborne | White Papers > Edition 29, EHS

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

Chin-Tsao Yang, Shu-Hou Wang, Milton Li, Wu-Hsiung Fu, & Max Chen, Facility department, Powerchip Semiconductor Corporation

During the design of PSC’s Fab 12A, whole system efficiency was promoted, particularly in terms of power consumption. One of the most effective energy-saving projects was to lower the temperature of cooling water to promote the operational efficiency of the chiller system. This measure resulted in power savings for the chiller system of about 15 percent or some 7GWH of electricity a year.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Conserving Natural Resources in Wafer Fabs - 01 March 2000

Point-of-Use Exhaust Control for Semiconductor Manufacturing: Saving Energy, Saving Money, Improving - 01 March 1999

Designing Chilled-Water Systems for the 21st Century - 01 March 1999

Oki Electric reveals fully depleted SOI process with reverse polarity - 06 October 2005

Applied Materials and AmberWave in strained silicon pact - 04 February 2005

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: