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Real-time profile control: advanced process control for copper CMP

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Doyle Bennett, Jimin Zhang, Bogdan Swedek, Jeff David & Manush Birang, Applied Materials, CMP Division, Sunnyvale, CA, USA & Dick de Roover, SC Solutions, Sunnyvale, CA, USA

ABSTRACT

Real-time profile control (RTPC™) has been implemented for 300-mm copper CMP via closed-loop control of bulk copper removal, on a withinwafer (WIW) basis. The method uses a high-resolution sensor to measure the copper thickness across the wafer during polishing (in situ). The bulk copper-removal process is controlled via incremental changes to polishing conditions in situ, real-time using a multi-zone polishing head, the Titan Profiler™. The RTPC system has demonstrated more uniform copper clearing, which provides lower and more consistent WIW copper loss than is possible with an open-loop process (i.e., fixed conditions).
Real-time profile control: advanced process control for copper CMP.

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