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Prospects of incorporating directed self-assembly into semiconductor manufacturing

01 December 2007 | By Mark Osborne | White Papers > Edition 36, Lithography

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R. Singh, T. Boland, R. Mulye, G. Gaur, J.Steelman, D. Arya, N. Srinidhi and P.Deshmukh, Holcombe Department of Electrical and Computer Engineering and Center for Silicon Nanoelectronics, Clemson University, South Carolina, USA

ABSTRACT

Directed self-assembly (DSL) has been projected as a potential solution to the critical dimension limit faced by conventional lithography techniques. In this paper we review the literature data on directed self-assembly to investigate the challenges in application of self-assembly techniques for mainstream semiconductor manufacturing.  Based on fundamental considerations and process-induced defects of DSL, it is highly unlikely that DSL will ever enter mainstream semiconductor manufacturing.

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