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Progress and challenges in PFC reductions at AMD

01 March 2003 | By Mark Osborne | White Papers > Edition 18, EHS

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Dan Seif and Silke Hermanns, AMD


From 1995 to year-end 2001, Advanced Micro Devices, Inc. (AMD) achieved an 18% reduction in perfluorocompound (PFC) emissions as measured by carbon equivalents (CE) despite significant growth in manufacturing activity and revenue. This reduction was achieved via chemistry changes, gas use optimization, new technology implementation, legacy technology phase-out, and point-of-use abatement. While significant emissions reductions have been made, new areas of PFC use and the projected growth of the industry present a continuing challenge. Of particular concern are PFC use in die packaging, single wafer pass etch chamber cleans, and post-etch residue stripping. Issues surrounding fugitive heat transfer fluid emissions and nitrous oxide are also presented.

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