Online information source for semiconductor professionals

PREVIEW: Edition 39: Technology transfer and ramp in a giant 300mm production fab

Popular articles

New Product: Applied Materials new EUV reticle etch system provides nanometer-level accuracy - 19 September 2011

Oberai discusses Magma’s move into solar PV yield management space - 29 August 2008

‚??Velocity‚?? the new buzzword in Intel‚??s PQS annual awards - 12 April 2012

Applied Materials adds Jim Rogers to Board of Directors - 29 April 2008

New Product: ASML Brion‚??s Tachyon MB-SRAF enables OPC-like compute times - 19 September 2011

This paper offers a sneak preview of the content of Semiconductor Fabtech Edition 39. Fabtech Cover

By Ernst Richter, Oguz Yavas, Chia-Yen Cha & Markus Sickmoeller, Inotera Memories Inc.; Juergen Daleiden, Stefan Holzhauser, Theam Wah Lee, Thomas Huber, Giorgio Schweeger & Ruediger Twele, Qimonda AG


This article follows up on a previously published paper that introduced the 110nm technology transfer of Dynamic Random Access Memory (DRAM) for the Inotera Memories joint venture at start-up [1]. In this paper, technology transfer and ramp of the 75nm DRAM technology is outlined for Inotera in full production mode. Again, technology transfer was done from Qimonda (previously Infineon Technologies) at Dresden in Germany where the technology was jointly developed with Nanya Technologies. Inotera at Taoyuan in Taiwan was the first receiving site to repeat the technology qualification. Continuous sales price reduction puts pressure on memory firms for fast introduction of technology shrinks to remain cost competitive [2]. Delays as short as a few days in the production ramp can translate into millions of dollars of missed opportunity in revenue. This paper sets forth the steps taken by the two companies to avoid such setbacks in the technology transfer.

Download Please login to download the paper. No account yet? Please register. It's free!

Related articles

Spansion: NOR no bore anymore! - 19 September 2007

300mm activity report: 2nd quarter 2002 - 01 September 2002

Spansion hits 25,000 wafer starts per quarter milestone at SP1 - 06 March 2008

OKI transfers semiconductor business to Rohm Co., Ltd. - 29 May 2008

Intel adds another 300mm fab to new build program - 21 February 2011

Reader comments

No comments yet!

Post your comment

Please enter the word you see in the image below: